| 脚位/封装 | FBGA-180 |
| 外包装 | |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 1.35V |
| 温度规格 | 0 C~+85 C |
| 速度 | 14 GB/S |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 512M |
| Bit Organization | x32 |
| Density | 16G |
| Version | KP |
| Max Clock Frequency | 1.75 GHz |
| Production Status | Production |
| Product Family | GDDR6 |
| Die Revision | C |
| 脚位/封装 | FBGA-180 |
| 外包装 | |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 1.35V |
| 温度规格 | 0 C~+85 C |
| 速度 | 14 GB/S |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 512M |
| Bit Organization | x32 |
| Density | 16G |
| Version | KP |
| Max Clock Frequency | 1.75 GHz |
| Production Status | Production |
| Product Family | GDDR6 |
| Die Revision | C |