| 脚位/封装 | FBGA-78 |
| 外包装 | TRAY |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 1.35V |
| 温度规格 | 0 C~+85 C |
| 速度 | 1600 MBPS |
| 标准包装数量 | 160 |
| 标准外箱 | |
| Number Of Words | 512M |
| Bit Organization | x8 |
| Density | 4G |
| Operating Temperature | commercial temperature(0°C~85°C) & 1.35 VDD power |
| Package Material | lead & halogen free(ROHS compliant) |
| Hynix Memory | H |
| No Of Banks | 8 banks |
| Product Family | DRAM |
| Die Generation | 6th |
| Shipping Method | tray |